Some 50,000 delegates from 130 countries will attend SUPERCOMM 2001, the communications and information technology exhibition and conference to be held at the Georgia World Congress Center in Atlanta, June 3-7.

          Jack Chalden, SUPERCOMM general manager, told GlobalFax that this year’s event will draw more interest from financial professionals, including analysts, institutional investors, merger and acquisition specialists and venture capitalists.

          The conference will include an international orientation and reception Sunday, June 3, as well as a Global Market Forum, Sunday, June 3 and Monday, June 4.

The Global Market Forum will offer a series of 16 special workshops and plenary and keynote presentations focusing on global communications technologies, markets and related business issues. The forum is a must for companies and individuals seeking to enter or expand business in global regional markets, according to Mr. Chalden.

“For example,” Mr. Chalden said, “representatives of a French company may come to learn how they are going to enter Argentina.”

As part of the conference June 6-7, the International Telecommunication Union (ITU) and the Telecommunications Industry Association (TIA) will present ITU/TIA Emerging Markets Conference: Latin America. Telecommunications decision makers from Latin America will highlight the technologies most in demand in that region.

SUPERCOMM 2001 will also provide international business matchmaking services, and a full international business center will be on-site for use by exhibitors and international participants.

An Export Interest Directory will be available to all international attendees in the International Business Center, Rooms 360-361 West. The directory lists U.S. exhibitors interested in exporting to other parts of the world.

Mr. Chalden added that SUPERCOMM is growing too large to stay in Atlanta, so it will be held in Chicago in 2004.

Visit www.supercomm2001.com for more information and to register. Mr Chalden may be reached at (800) 266-6669 ext. 7744 or jchalden@tia.eia.org